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Asia Semiconductor News

2024/8/15

▼Semiconductors
China: Major Chinese companies stockpile Samsung HBM, additional US regulations in sight
China: 2Q semiconductor sales up 22% to 6.7 trillion yen = SIA
China: Memory maker CXMT may begin mass production of HBM2
China: Sino-Micro semiconductor equipment completes Shanghai port industrialization base
China: Sealing and inspection company Changjiang Technology enters into strategic partnership with US Allegro
China: Ganfeng Lithium establishes IC manufacturing subsidiary
China: HKC plans to produce power semiconductors for NEVs in Shenzhen
China: Semiconductor imports up 15% in July, first positive growth in two months
China: Foundry Huahong sees 90% drop in profits in April-June
China: SMIC sees 20% increase in revenue and 60% drop in profits in April-June
Taiwan: NVIDIA Blackwell, TSMC may postpone mass production
Taiwan: NVIDIA design Defect issue “has a certain impact on Taiwan’s supply chain”
Taiwan: Blackwell shipment delays, Wei Ying and others acknowledged
Taiwan: UMC’s July sales increase of 9.6%
Taiwan: TSMC’s 5/3nm contract prices to rise in 2025
Taiwan: TSMC outsources CoW process to Sun Moonlight for the first time
Taiwan: TSMC’s Kumamoto plant unaffected by Miyazaki M7.1 earthquake
Taiwan: KYEC to increase capital investment by 57% in 2024
Korea: Samsung denies reports that HBM3E has been approved by NVIDIA
Korea: SK Hynix’s US sealing plant to receive subsidies of up to US$450 million
Korea: Samsung’s foundry may post trillions of won in the red in 2024
Malaysia: Southeast Asia’s largest IC design park opens in the capital area
Malaysia: Germany’s Infineon opens third Klim plant