Contact E-mail ken.nagashima@eclipse-tw.com
ECLIPSE TECHNOLOGY INC. PRODUCT LINE
STAMP LEADFRAME
☆DISCRETE, POWER DEVICE & IR SENSORS
☆STANDARD, MATRIX & HIGH DENSITY APPLICATION
☆IC LEAD FRAME – FINE PITCH ．HIGH DENSITY
ETCHED LEADFRAME
☆HDLF DFN, QFN & POWER QFN WITH TOP-BOTTOM HALF ETCH
☆WING FRAMES FOR RF MODULE & MICROWAVE APPLICATIONS
☆SELECTIVE OR FULL PLATING ON 0.127MM – 0.762MM (t) BASE MATERIAL
☆PI TAPE ETCHING PROCESS FOR CUSTOMIZED APPLICATIONS
STAMPED HEATSPREADER AND CU-CLIP
☆COPPER BASE WITH NICKEL PLATED HEATSPREADER
☆CERAMIC HEATSPREADER
☆ALUMINUM HEATSPREADER
☆CU-CLIP FOR POWER QFN
☆SPECIAL MATERIAL HEATSLUG FOR THERMAL MANAGEMENT
CERAMIC SUBSTRATES AND MODULES
☆HIGH TEMP CO-FIRED CERAMIC SUBSTRATES AND MODULE
☆LOW TEMP CO-FIRED CERAMIC SUBSTRATES AND MODULES
Contact E-mail ken.nagashima@eclipse-tw.com